CyberPowerPC Microphone MPC603EC Uživatelský manuál stáhnout pdf (Strana 29)

603 Hardware Specifications, REV 2 29

Preliminary—Subject to Change without Notice

Clean after reﬂow De-ionized (D.I.) water if water-soluble paste is used

•Cleaner requirements—conveyorized, in-line

•Minimum of four washing chambers

—Pre-clean chamber: top and bottom sprays, minimum top-side

pressure of 25 psig, water temperature of 70 °C minimum, dwell

time of 24 seconds minimum, water is not re-used, water ﬂow rate

of 30 liters/minute.

—Wash chamber #1: top and bottom sprays, minimum top-side

pressure of 48 psig, minimum bottom-side pressure of 44 psig,

water temperature of 62.5 °C (±2.5 °C), dwell time of 48 seconds

minimum, water ﬂow rate of 350 liters/minute.

—Wash chamber #2: top and bottom sprays, minimum top-side

pressure of 32 psig, minimum bottom-side pressure of 28 psig,

water temperature of 72.5 °C (±2.5 °C), dwell time of 48 seconds

minimum, water ﬂow rate of 325 liters/minute.

—Final rinse chamber: top and bottom sprays, minimum top-side

pressure of 25 psig, water temperature of 72.5 °C minimum, dwell

time of 24 seconds minimum, water ﬂow rate of 30 liters/minute.

•No cleaning required if “no clean solder paste” is used

Touch-up and repair Water soluble (for example, Kester 450) or No Clean Flux

C4FP removal Hot air rework

C4FP replace Hand solder

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CyberPowerPC Microphone MPC603EC Uživatelský manuál Strana 29